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technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com specification hbtgfr421 - kr customer approval approval drawn ssc pb free
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com [ contents ] 1. description 2. absolute maximum ratings 3. electro - optical characteristics 4. characteristic diagrams 5. reliability result 6. rank 7. outline dimension 8. material 9. reel structure 10. packing 11. soldering profile 12. precaution for use
???? : ssc - qp - 7 - 07 - 25 (rev.0.0) technical data sheet rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com hbtgfr421 - kr ? cellular phone s keypad lightning ? information boards features applications - small size suitable for compact appliances. - surface - mounted chip led device. - pb - free and rohs complaint component. - high brightness, high efficiency - tape and reel packing. - increases the life time of battery. 1. description hbtgfr421 - kr ? 1.6 x 1.5 x 0.5 mm ? untited , diffused flat mold ? wavelength : - . red : 625 nm - . green : 525 nm - . blue : 472 nm
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 2. absolute maximum ratings 3. electro - optical characteristics 50 20 66 green blue 50 20 66 value - 40 ~ 100 t stg . storage temperature mw 69 p d power dissipation - 40 ~ 85 t opr . operating temperature ma 100 i fm *1 peak forward current ma 30 i f forward current unit red symbol parameter * 1 i fm conditions: pulse width tw 1msec and duty ratio 1/10. * 2 the luminous intensity iv is measured at the peak of the spati al pattern which may not be aligned with the mechanical axis of the led package. *3 1/2 is the off - axis where the luminous intensity is 1/2 the peak intensity. [note] tolerance : iv 10%, d 2nm, , v f 0.1v ( ta=25 ) ( ta=25 ) 20 i f =10 ? ? blue 30 green 477 472 465 i f =20 ? blue 85 50 25 i f =10 ? blue 270 220 90 green v r =5v i r 3.3 3.0 2.7 i f =10 ? v f blue 3.3 3.1 2.7 green r,g,b red green red red r/g/b red color mcd 90 70 50 i v luminous intensity *2 635 625 615 - 515 - 1.7 min - 535 10 2.3 max 120 15 525 - 1.9 typ ? i f =30 ? (total) 2 1/2 viewing angle *3 nm d wavelength v forward voltage nm spectral bandwidth ? reverse current unit condition symbol parameter
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com forward current vs. forward voltage relative luminous intensity vs. forward current ta = 25 o spectrum forward current vs. ambient temperature (per die) 4. characteristic diagrams -25 0 25 50 75 100 0 10 20 30 40 red blue / green forward current i f (ma) ambient temperature ta( o c) 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 0.1 1 10 100 forward voltage v f [v] forward current i f [ma] red green blue 0 5 10 15 20 25 30 35 40 0 20 40 60 80 100 120 140 160 180 relative intensity i v [%] forward current i f [ma] red green blue 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 intensity[a.u.] wavelength [nm]
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com radiation diagram ta = 25 o 0 30 60 90 120 150 180
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 5. reliability test 0/22 1 time 85 , 85% 24hrs ? reflow 3 times (max 260 10sec) ? thermal shock 30 cycle thermal resistance test 0/22 500 hrs 10ma, @60 ,90% operating at high temperature / high humidity 0/22 500 hrs 10ma, @85 operating at high temperature 0/22 100 cycle - 40~85 shift (2hr/cycle) thermal shock test 0/22 500 hrs 10ma, @25 operating at room t emperature number of damaged duration / cycle test conditions item * criterion initial value 0.1v v f > initial value * 0.5 iv ok msl : 2a (30 , 60% : 4 weeks)
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 6. rank i f = 10ma 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 rank 470~477 465~470 515~535 615~635 3.1~3.3 470~477 465~470 515~535 615~635 2.9~3.1 470~477 465~470 515~535 615~635 2.7~2.9 3.1~3.3 470~477 465~470 515~535 615~635 3.1~3.3 470~477 465~470 515~535 615~635 2.9~3.1 470~477 465~470 515~535 615~635 2.7~2.9 2.9~3.1 470~477 465~470 515~535 615~635 3.1~3.3 470~477 465~470 515~535 615~635 2.9~3.1 470~477 465~470 515~535 615~635 2.7~2.9 2.7~2.9 1.7~2.3 25~85 90~270 50~90 blue green red blue green red blue green red w d [nm] (if = 20ma) v f [v] i v [ mcd ]
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 0.05 7. outline dimension tolerance 0.1, unit : L 8. material au plated electrode epoxy gold ingan / alingap bt - resin pcb material encapsulate wire chip (b,g/r) substrate item [recommended solder pattern] cathode red green blue anode(common)
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com (1) quantity : 4000pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion strength to be 0. 1 - 0.7n when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape (4) package : p/n, manufacturing data code no. and quantity to b e indicated on a damp proof package 9. reel structure 0.05 (2.75) 4.0 label -3 +0 2 180 13 0.2 60 -0 +0.2 22 0.2 9 11.4 0.3 0.1 2.0 0.05 4.0 1.5 0.5 0.1 +0.1 -0 1.75 0.2 8.0 3.5 0.05 0.05 0.2 0.05 0.05 0.1 0.05 1.73 1.75 0.7
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 10. packing outer box structure c a b 7inch 245 220 142 size (mm) material : paper(sw3b(b)) type aluminum vinyl bag reel desi pak rank: part number : lot number : xxxxxxxxxx quantity : xxxx xxx seoul semiconductor co., ltd. rank: part number : lot number : xxxxxxxxxx quantity : xxxx xxx seoul semiconductor co., ltd. xxxxxx xxxxxx 1 side rank: part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. xxxxxx a b c 1 rohs 2 2 side lot number rank qty seoul semiconductor co., ltd. #### ### ### ### ####### humidity indicator
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 10 sec. max. soldering time condition 240 max. peak - temperature 120 sec. max. pre - heat time 120~150 pre - heat lead solder 10 sec. max. soldering time condition 260 max. peak - temperature 120 sec. max. pre - heat time 150~200 pre - heat lead free solder lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. lead-frame solder (1) lead solder (2) lead - free solder (3) hand soldering conditions do not exceed 3 seconds at maximum 280 o c under soldering iron. note : in case that the soldered products are reused in solderin g process, we don t guarantee the products. 11. soldering profile
technical data sheet ???? : ssc - qp - 7 - 07 - 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 12. precaution for use (1) storage leds must be stored at clean atmosphere. if the leds are stored for 3 months or more after shipment from ssc, storage in a sealed container with a n itrogen atmosphere is recommended. to avoid absorption of moisture, it is recommended to store in a dry box (or a desiccator ) with a desiccant. * shelf life : 12 months at < 40 o c and 90%rh (2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. after opened and mounted the soldering shall be quickly. * within 672 hours at factory conditions of equal to or less than 30 o c/60%rh, or stored at < 10% rh (3) repack unused products with anti - moisture packing, fold to close any opening and then store in a dry place. (4) in the case of change color of indicator on desiccant, compo nents shall be dried 10 - 12hr at 60 5 o c. (5) when the led is operating, the driving current should be det ermined after considering the maximum ambient temperature requirements. (6) when using multiple leds , it is recommended to connect a resistor on each led. otherwise, leds may vary due to variation in forward voltage of the leds . (7) the driving circuit must be designed to allow forward voltag e only when it is on or off. if the reverse voltage is applied to led, migration can be generated resulting in led damage (8) any mechanical force or excessive vibration should be avoide d during temperature cooling process to normal temperature after reflow. (9) rapid cooling shall be avoided. (10) led should not be placed on a flexible area on the pcb. (11) this device should not be used in any type of fluid such as water, oil, organic solvent etc. when washing is required, ipa should be used. (12) anti radioactive ray design is not considered for the produ cts. (13) damage prevention from esd or surge. it is highly recommended to use the wrist - band or anti electrostatic gloves when handling the led s all devices, equipments and machines mush be properly grounded (14) the appearance and specifications of the product may be mod ified for improvement without notice.

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